1. Application Scenarios: Suitable for high-purity cleaning and etching of semiconductor wafers, photovoltaic silicon wafers, silicon materials, phosphorus-silica glass, quartz crystals, alunite crystals, mica crystals, diamond crystals, gemstones, and jade, among others.

2. Functions: Mature configurations for various cleaning processes including medium and high frequency, ultra-high frequency, megasonic waves (wet cleaning processes: RCA standard cleaning method, diluted chemical method, IMEC cleaning method), chemical etching cleaning, single-wafer cleaning, wafer scrubbing, high-pressure spray cleaning, rapid filling and draining tanks, automatic frequency tracking with an accuracy of 1H, built-in frequency division and sweep functions, and switchable frequencies.

3. Focus on the use of SEMI high-standard chemical solutions for wafer cleaning in the R&D and manufacturing processes of third-generation semiconductor SiC MOSFET chips.

4. To enhance the cleaning effectiveness of chemical reagents, special techniques are employed to create a more suitable cleaning environment for wafers.

5. Mature silicon wafer drying process and unique pre-treatment technology before drying. Various advanced process technologies ensure that the silicon wafers are dried without leaving any watermarks.

6. Chemical Cleaning Machine: Utilizes acidic agents such as hydrofluoric acid, hydrochloric acid, and nitric acid, or alkaline cleaning solutions for product processing.

7. The tank body and frame of the equipment are made of corrosion-resistant materials, with a mature overall design.