1. Application Scenarios: Suitable for cleaning high-end precision products such as PCBA boards, stencils, CCM semiconductors, fixtures, scraper blades, condensers, and more.

2. Application Fields: Utilized in the SMT precision electronics, PCB manufacturing, printing industries, as well as in military, aerospace electronics, medical, renewable energy, and automotive sectors.

3. Features: Full-process visualization with a viewing window in the cleaning chamber for clear visibility of the cleaning process; scientifically designed nozzles with a left-to-right gradually increasing distribution to enhance cleaning efficiency and an up-down staggered distribution to eliminate cleaning blind spots completely.

4. Functions: Capable of cleaning a variety of large batches of PCBA boards, effectively removing organic and inorganic contaminants such as rosin flux, water-soluble flux, no-clean flux/solder paste residuals on the surface of DIP/THT PCBAs after soldering.

5. Fully Automatic Cleaning Mode: Automatic cleaning with spray within the cleaning chamber and air knife drying for the entire process.

6. Adjustable Nozzle Design: Addresses the issue of collision and splashing of small-sized PCBAs under high-pressure spray during cleaning. Water tank heating system: significantly boosts cleaning efficiency and reduces cleaning time.

7. Comprehensive Cleaning System: Compatible with both water and chemical cleaning, providing thorough and effective removal of organic and inorganic contaminants such as water-soluble flux and solder paste residuals on surfaces.

8. Air Knife Water Removal + Ultra-long Infrared Hot Air Circulation Drying Section; Overall 304 stainless steel body resistant to acidic, alkaline, and other cleaning solutions.